English  |
| Quantity: | |
|---|---|
RF-UV-25W RF-UV-20W RF-UV-15W
RAY FINE
Silicon Wafer Dicing, PCB stencil Die Board UV Laser Cutting Machine for PCB FPC Circuit Board
355nm UV laser bigger power, specially used for cutting PCB FPC etc. With CCD Visual positioning system, 12 Million camera, can identify the cutting line clearly, high precision
Processed samples
Technical Parameter
| Model | YJ-UV-15W | YJ-UV-20W | YJ-UV-25W |
| Output power | >15w@50KHZ | >20W@60KHZ | >25w@50KHZ |
| Laser beam quality M2 | <1.2 | ||
| Pulse duration | <15 | <15 | <20 |
| Beam Circularity | >90% | ||
| Beam Full Divergence Angle | ≤2mrad | ||
| Bean Diameter(mm) | ~0.55 | ~0.47 | ~0.55 |
| Pulse Repetition Rate Rang | 40-300khz | ||
| Center Wavelength | 355nm | ||
| Cooling type | water | ||
| Marking Area | 110x110 | ||
| How to get focus | double red light | ||
| Max positioning speed | 8000mm/s | ||
| Supply voltage | AC110V 60HZ / AC220V 50HZ | ||
| Control program | EZCAD / RUIDA | ||
Silicon Wafer Dicing, PCB stencil Die Board UV Laser Cutting Machine for PCB FPC Circuit Board
355nm UV laser bigger power, specially used for cutting PCB FPC etc. With CCD Visual positioning system, 12 Million camera, can identify the cutting line clearly, high precision
Processed samples
Technical Parameter
| Model | YJ-UV-15W | YJ-UV-20W | YJ-UV-25W |
| Output power | >15w@50KHZ | >20W@60KHZ | >25w@50KHZ |
| Laser beam quality M2 | <1.2 | ||
| Pulse duration | <15 | <15 | <20 |
| Beam Circularity | >90% | ||
| Beam Full Divergence Angle | ≤2mrad | ||
| Bean Diameter(mm) | ~0.55 | ~0.47 | ~0.55 |
| Pulse Repetition Rate Rang | 40-300khz | ||
| Center Wavelength | 355nm | ||
| Cooling type | water | ||
| Marking Area | 110x110 | ||
| How to get focus | double red light | ||
| Max positioning speed | 8000mm/s | ||
| Supply voltage | AC110V 60HZ / AC220V 50HZ | ||
| Control program | EZCAD / RUIDA | ||
