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M.T: +86 15314183288
FAX: +86 635 8208986
Email: info@rayfinetech.com
Add: NO.177th, Dongchang Dong Road,Liaocheng city,Shandong,China
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Silicon Wafer Dicing, PCB Stencil Die Board UV Laser Cutting Machine for PCB FPC Circuit Board

355nm UV laser bigger power, specially used for cutting PCB FPC etc. With CCD Visual positioning system, 12 Million camera, can identify the cutting line clearly, high precision
Availability:
Quantity:
  • RF-UV-25W RF-UV-20W RF-UV-15W
  • RAY FINE

Silicon Wafer Dicing, PCB stencil Die Board UV Laser Cutting Machine for PCB FPC Circuit Board

355nm UV laser bigger power, specially used for cutting PCB FPC etc. With CCD Visual positioning system, 12 Million camera, can identify the cutting line clearly, high precision

DSC04254


DSC07322

Processed samples

cutting brass

CUT

Technical Parameter


Model
YJ-UV-15W
YJ-UV-20W
YJ-UV-25W
Output power
>15w@50KHZ
>20W@60KHZ
>25w@50KHZ
Laser beam quality M2
<1.2
Pulse duration
<15
<15
<20
Beam Circularity
>90%
Beam Full Divergence Angle
≤2mrad
Bean Diameter(mm)
~0.55
~0.47
~0.55
Pulse Repetition Rate Rang
40-300khz
Center Wavelength
355nm
Cooling type
water
Marking Area
110x110
How to get focus
double red light
Max positioning speed
8000mm/s
Supply voltage
AC110V 60HZ / AC220V 50HZ
Control program
EZCAD / RUIDA


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