1064nm infrared picosecond laser: high-precision marking and cutting of glass, drilling and cutting of sapphire, marking/drilling micro-holes/cutting of ceramics, cutting of LCD/OLED display panels, LED wafer scribing and cutting
532nm green light picosecond laser: 3C product weakening SiP package circuit etching and cutting fingerprint module cutting high-precision marking of ceramics camera module cutting printed circuit board cutting metal/ceramic micro-hole drilling thin film cutting,
355nm ultraviolet picosecond laser: PVD ink removal QR code coding QR code engraving in glass ceramic marking, drilling, wafer scribing